拜登赶在离任前加速推进芯片制造回流 台积电与格芯补贴即将落地

Cnbeta.com.tw - November 7, 2024

拜登赶在离任前加速推进芯片制造回流 台积电与格芯补贴即将落地

媒体援引知情人士透露的消息报道称,台湾芯片制造巨头台积电以及美国芯片制造领军者格芯已经就数十亿美元的赠款补贴以及特殊贷款达成具有约束力的协议,以支持这两大芯片制造公司在美国建设工厂。 拜登团队正在争分夺秒地争取完成《芯片法案》补贴发放,实现拜登政府所大力宣传的“芯片制造回流美国”雄心壮志,知情人士表示,有美国官员预计在未来几周内宣布达成协议。据了解,这些关于补贴以及贷款发放的重要协议,于今年早些时候宣布为初步达成性质的协议,如今拜登政府正努力在1月份任期结束之前将美国政府于2022年通过的《芯片与科学法案》(简…

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