三星斩获博通2000亿美元巨额订单 进一步缩减与台积电差距

Cnbeta.com.tw - July 25, 2026

三星斩获博通2000亿美元巨额订单 进一步缩减与台积电差距

在芯片代工领域,台积电(TSMC)凭借领先的技术和先进封装工艺长期占据主导地位。然而,三星正在通过提供超出单一2nm代工维度的综合解决方案,展示出强大的竞争潜力。据最新消息,三星与博通(Broadcom)签署了一项谅解备忘录,将在未来五年内展开深度合作,共同构建下一代人工智能基础设施,该协议的总价值高达2000亿美元。 根据合作协议,双方合作的重点包括三星的2nm环绕栅极(GAA)制程技术以及下一代HBM4高带宽内存。博通将在其AI加速器中采用三星的HBM4及后续增效版HBM4E内存,并利用三星的2nm节点制造…

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