Yahoo Entertainment - January 14, 2025
Morgan Stanley最新報告透露,NVIDIA正大幅調整其AI晶片的封裝策略,從原先的CoWoS-S技術轉向效能更高的CoWoS-L。為此,台積電(TSMC)已應NVIDIA的要求,開始將部分CoWoS-S產能轉為CoWoS-L,以生產NVIDIA的GB300A單晶片GPU。分析指出,此舉不僅強化NVIDIA在AI市場的領導地位,也將為台積電帶來長期成長動能。
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